Ferdinand-Braun-Institut

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) - among them the FBH - will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies.

We've developed a fabrication protocol for compact broadband terahertz antennas based on 3D printing. Our approach also streamlines integration of these micro-antennas into semiconductor chips and other substrates via a precise transfer process.

Prof. Dr. Tim Schröder from the Department of Physics at Humboldt-Universität zu Berlin and the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH), has been awarded a Consolidator Grant from the European Research Council (ERC) for his research in the field of quantum physics and quantum technology. The funding for the research project "Multidimensional Hyperentangled Photon Graph States", HyperGraph, amounts to around 2.5 million euros over five years. The ERC grants are among the most prestigious awards in European research funding and are awarded for outstanding scientific achievements.

A successful week came to an end for Sascha Neinert and Kirti Vardhan. The two young scientists from the Joint Lab Integrated Quantum Sensors were awarded the jury prize of the Berlin Quantum Pioneer incubation program for their research work carried out in the MyoQuant project.

Our 5G-MIMO measurement system uses active load-pull for precise impedance matching, optimizing transistor performance under large-signal CW excitation. The vector-corrected, on-wafer system enhances mmWave load-pull accuracy for advanced wireless and space applications.

The current frequent issue focuses on recent FBH developments based on wide-bandgap and ultra-widebandgap semiconductors - and their important role in reducing the energy consumption of modern systems and preserving resources.

Securing skilled workers for the chip industry – with this goal in mind, the nationwide flagship project “Skilled workers for microelectronics: skills4chips” funded by the Federal Ministry of Education and Research (BMBF), launches on November 1, 2024. A key component is the establishment of a national educational academy for microelectronics and microsystem technology. The “Microtec Academy” will address the growing demand for skilled workers with innovative training programs and is coordinated by the Berlin-based Ferdinand-Braun-Institut (FBH).