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MicroLAB

No matter if it is a computer, mobile phone, ABS or airbag system, nearly every modern technical solution requires the tiny all-rounders developed from micro electronics and microsystems technology. The school lab MicroLAB explains and shows, how such micro devices are manufactured.

Deposition of aluminum layer
An aluminum layer is deposited onto the glass carrier before transferring the structure (©GenaU/Rasche)
Resist coating
Photoresist is applied on the glass carrier in order to structure the aluminum layer (©GenaU/Rasche)
Exposure
The structure is transferred onto the glass carrier by exposure to UV light (©GenaU/Rasche)
A young woman in protective clothing places a wafer piece in a coating spinner
Trainee placing a wafer piece into a coating spinner (© Matthias Baumbach)
[Translate to English:] A young woman stands in a laboratory holding a wafer piece in a beaker of acid to etch away areas not covered with resist.
After exposure, the areas covered by resist remain, the surrounding areas are etched away in an acid bath (© Matthias Baumbach)
A shot from above showing a young woman separating a piece of wafer into individual chips. There is also a container with whole wafers on the table.
Trainee separating a large wafer into individual chips (© Matthias Baumbach)

The laboratory is run by Lise-Meitner-Schule and Ferdinand-Braun-Institut and combines practical experiments with an insight view into the work routine of a research institute. The presentation is held in German language.

MicroLAB is a member of GenaU, a network of Berlin and Brandenburg school laboratories.

www.microlab-berlin.de