2. About us
  3. Structure
  4. Labs & Departments
  5. III-V Electronics
  6. Joint Lab THz Components & Systems

Joint Lab THz Components & Systems

In our Joint Lab THz Components & Systems we are working on terahertz technologies targeting components and systems for 6G wireless communications and sensing. The focus of our work in the field of terahertz components and systems is on InP-HBT transceiver circuits, integrated InP ultra-wideband components and THz imaging with transistor detectors including THz cameras. For this we use the InP and GaN processes established at FBH. The work is carried out in close collaboration with the Goethe-Leibniz-Terahertz-Center at the Goethe University Frankfurt am Main.

Flip-chip mounted THz MMIC chips on aluminum nitride substrate
Flip-chip mounted THz MMIC chips on aluminum nitride substrate