FBH uses LayTec's EpiCurve in-situ metrology to eliminate SiC/GaN wafer cracking in ICP etching

In-situ metrology system maker LayTec AG of Berlin, Germany says that researchers at Berlin-based Ferdinand-Braun-Institut für Höchstfrequenztechnik (FBH) have applied EpiCurve in-situ metrology for optimizing etching recipes in a Sentech SI 500 inductively coupled plasma reactive-ion etch (ICP-RIE) tool.
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Quelle: semiconductor-today.com 16.01.2015 (in Englisch)